Abstract
The main objective of this paper is to demonstrate the implementation of different dynamic stress test methods within a unified stress test apparatus by retaining most of the functional modules constant and merely changing the Device Under Test (DUT) for a variety of power devices and stress patterns. A prototype has been constructed which is capable of implementing Short Circuit (SC) and Unclamped Inductive Switching (UIS), as well as Double Pulse (DP) testing for stressing power semiconductor devices of different voltage and current classes. Last but not least, a protection circuit has been incorporated to safely turn off the power circuit in case of DUT failure.
Originalsprache | englisch |
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Aufsatznummer | 113852 |
Fachzeitschrift | Microelectronics Reliability |
Jahrgang | 114 |
DOIs | |
Publikationsstatus | Veröffentlicht - Nov. 2020 |
ASJC Scopus subject areas
- Elektronische, optische und magnetische Materialien
- Atom- und Molekularphysik sowie Optik
- Sicherheit, Risiko, Zuverlässigkeit und Qualität
- Physik der kondensierten Materie
- Oberflächen, Beschichtungen und Folien
- Elektrotechnik und Elektronik