Measurement techniques to predict the soft failure susceptibility of an IC without the aid of a complete software stack

Suyu Yang, Benjamin Orr, Yuangdong Guo, Yilong Zhang, David Pommerenke, Hideki Shumiya, Junji Maeshima, Taketoshi Sekine, Yuzo Takita, Kenji Araki

Publikation: Beitrag in Buch/Bericht/KonferenzbandBeitrag in einem Konferenzband

Abstract

In this paper, several methods are outlined for detecting functional changes in an IC due to external interference such as ESD or EMI. The goal is to provide diagnostic tools for detection of potential soft failure susceptibilities of complex systems during the hardware design stage without the aid of any complex software.

Originalspracheenglisch
Titel2016 IEEE International Symposium on Electromagnetic Compatibility, EMC 2016
Herausgeber (Verlag)Institute of Electrical and Electronics Engineers
Seiten41-45
Seitenumfang5
ISBN (elektronisch)9781509014415
DOIs
PublikationsstatusVeröffentlicht - 19 Sep 2016
Extern publiziertJa
Veranstaltung2016 IEEE International Symposium on Electromagnetic Compatibility: EMC 2016 - Ottawa, Kanada
Dauer: 25 Jul 201629 Jul 2016

Publikationsreihe

NameIEEE International Symposium on Electromagnetic Compatibility
Band2016-September
ISSN (Print)1077-4076
ISSN (elektronisch)2158-1118

Konferenz

Konferenz2016 IEEE International Symposium on Electromagnetic Compatibility
LandKanada
OrtOttawa
Zeitraum25/07/1629/07/16

ASJC Scopus subject areas

  • !!Condensed Matter Physics
  • !!Electrical and Electronic Engineering

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