Investigation of Spice Models for Overvoltage Protection Devices with Respect to Fast Transients

Susanne Bauer; Werner Renhart; Oszkar Biro; Christian Turk; Christoph Maier; Gunter Winkler; Bernd Deutschmann

doi:10.1109/EMCSI.2018.8495349

Investigation of Spice Models for Overvoltage Protection Devices with Respect to Fast Transients

Susanne Bauer^*, Werner Renhart, Oszkar Biro, Christian Turk, Christoph Maier, Gunter Winkler, Bernd Deutschmann

^*Korrespondierende/r Autor/-in für diese Arbeit

Publikation: Beitrag in Buch/Bericht/Konferenzband › Beitrag in einem Konferenzband › Begutachtung

Abstract

Models of overvoltage protection devices such as voltage suppressor diodes (TVS) are available for the most part in circuit analyzer tools. During the course of investigating the simulation of such protection devices via LTspice in the context of fast transient phenomena some assumptions of those existing models can present problems. This is the case regarding the model of the junction capacitances, especially for the cutoff region when predicting the disturbances generated by those devises.

Originalsprache	englisch
Titel	2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity, EMC, SI and PI 2018
Herausgeber (Verlag)	Institute of Electrical and Electronics Engineers
ISBN (elektronisch)	9781538666210
DOIs	https://doi.org/10.1109/EMCSI.2018.8495349
Publikationsstatus	Veröffentlicht - 17 Okt. 2018
Veranstaltung	2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity, EMC, SI and PI 2018 - Long Beach, USA / Vereinigte Staaten Dauer: 30 Juli 2018 → 3 Aug. 2018

Konferenz

Konferenz	2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity, EMC, SI and PI 2018
Land/Gebiet	USA / Vereinigte Staaten
Ort	Long Beach
Zeitraum	30/07/18 → 3/08/18

ASJC Scopus subject areas

Sicherheit, Risiko, Zuverlässigkeit und Qualität
Signalverarbeitung
Energieanlagenbau und Kraftwerkstechnik
Elektrotechnik und Elektronik

Zugriff auf Dokument

10.1109/EMCSI.2018.8495349

Andere Dateien und Links

http://www.scopus.com/inward/record.url?scp=85056600474&partnerID=8YFLogxK

Kabelschirme - Wirkung transienter Phänomene auf Kabelschirme
Bauer, S. M.
1/01/18 → 31/08/20
Projekt: Forschungsprojekt

2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity, EMC, SI and PI 2018
Susanne Maria Bauer (Teilnehmer/-in)
30 Juli 2018 → 3 Aug. 2018
Aktivität: Teilnahme an / Organisation von › Konferenz oder Fachtagung (Teilnahme an/Organisation von)

Dieses zitieren

Bauer, S., Renhart, W., Biro, O., Turk, C., Maier, C., Winkler, G., & Deutschmann, B. (2018). Investigation of Spice Models for Overvoltage Protection Devices with Respect to Fast Transients. in 2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity, EMC, SI and PI 2018 Artikel 8495349 Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/EMCSI.2018.8495349

Investigation of Spice Models for Overvoltage Protection Devices with Respect to Fast Transients. / Bauer, Susanne; Renhart, Werner ; Biro, Oszkar et al.
2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity, EMC, SI and PI 2018. Institute of Electrical and Electronics Engineers, 2018. 8495349.

Publikation: Beitrag in Buch/Bericht/Konferenzband › Beitrag in einem Konferenzband › Begutachtung

Bauer, S, Renhart, W , Biro, O, Turk, C, Maier, C, Winkler, G & Deutschmann, B 2018, Investigation of Spice Models for Overvoltage Protection Devices with Respect to Fast Transients. in 2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity, EMC, SI and PI 2018., 8495349, Institute of Electrical and Electronics Engineers, 2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity, EMC, SI and PI 2018, Long Beach, USA / Vereinigte Staaten, 30/07/18. https://doi.org/10.1109/EMCSI.2018.8495349

Bauer S, Renhart W , Biro O, Turk C, Maier C, Winkler G et al. Investigation of Spice Models for Overvoltage Protection Devices with Respect to Fast Transients. in 2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity, EMC, SI and PI 2018. Institute of Electrical and Electronics Engineers. 2018. 8495349 doi: 10.1109/EMCSI.2018.8495349

@inproceedings{510f353961dc45d1a7374079013ffe59,

title = "Investigation of Spice Models for Overvoltage Protection Devices with Respect to Fast Transients",

abstract = "Models of overvoltage protection devices such as voltage suppressor diodes (TVS) are available for the most part in circuit analyzer tools. During the course of investigating the simulation of such protection devices via LTspice in the context of fast transient phenomena some assumptions of those existing models can present problems. This is the case regarding the model of the junction capacitances, especially for the cutoff region when predicting the disturbances generated by those devises.",

keywords = "electromagnetic compatibility, fast transients, LTspice, overvoltage protection, transient voltage suppressors (TVS), voltage suppressor diodes",

author = "Susanne Bauer and Werner Renhart and Oszkar Biro and Christian Turk and Christoph Maier and Gunter Winkler and Bernd Deutschmann",

year = "2018",

month = oct,

day = "17",

doi = "10.1109/EMCSI.2018.8495349",

language = "English",

booktitle = "2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity, EMC, SI and PI 2018",

publisher = "Institute of Electrical and Electronics Engineers",

address = "United States",

note = "2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity, EMC, SI and PI 2018 ; Conference date: 30-07-2018 Through 03-08-2018",

}

TY - GEN

T1 - Investigation of Spice Models for Overvoltage Protection Devices with Respect to Fast Transients

AU - Bauer, Susanne

AU - Renhart, Werner

AU - Biro, Oszkar

AU - Turk, Christian

AU - Maier, Christoph

AU - Winkler, Gunter

AU - Deutschmann, Bernd

PY - 2018/10/17

Y1 - 2018/10/17

N2 - Models of overvoltage protection devices such as voltage suppressor diodes (TVS) are available for the most part in circuit analyzer tools. During the course of investigating the simulation of such protection devices via LTspice in the context of fast transient phenomena some assumptions of those existing models can present problems. This is the case regarding the model of the junction capacitances, especially for the cutoff region when predicting the disturbances generated by those devises.

AB - Models of overvoltage protection devices such as voltage suppressor diodes (TVS) are available for the most part in circuit analyzer tools. During the course of investigating the simulation of such protection devices via LTspice in the context of fast transient phenomena some assumptions of those existing models can present problems. This is the case regarding the model of the junction capacitances, especially for the cutoff region when predicting the disturbances generated by those devises.

KW - electromagnetic compatibility

KW - fast transients

KW - LTspice

KW - overvoltage protection

KW - transient voltage suppressors (TVS)

KW - voltage suppressor diodes

UR - http://www.scopus.com/inward/record.url?scp=85056600474&partnerID=8YFLogxK

U2 - 10.1109/EMCSI.2018.8495349

DO - 10.1109/EMCSI.2018.8495349

M3 - Conference paper

AN - SCOPUS:85056600474

BT - 2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity, EMC, SI and PI 2018

PB - Institute of Electrical and Electronics Engineers

T2 - 2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity, EMC, SI and PI 2018

Y2 - 30 July 2018 through 3 August 2018

ER -

Investigation of Spice Models for Overvoltage Protection Devices with Respect to Fast Transients

Abstract

Konferenz

ASJC Scopus subject areas

Zugriff auf Dokument

Andere Dateien und Links

Fingerprint

Projekte

Kabelschirme - Wirkung transienter Phänomene auf Kabelschirme

Aktivitäten

2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity, EMC, SI and PI 2018

Dieses zitieren