Intermetallic Compound and Void Kinetics Extraction From Resistance Evolution in Copper Pillars During Electromigration Stress Tests

C. Hartler, S. Moreau, E. Chery, J. Charbonnier, J. Siegert, A. Plihon, M. Assous, Stefan Mitsche, Sanja Simic, F. Schrank, Werner Grogger

Publikation: Beitrag in einer FachzeitschriftArtikelForschung

Originalspracheenglisch
Aufsatznummer17822358
Seiten (von - bis)313-320
FachzeitschriftIEEE Transactions on Device and Materials Reliability
Jahrgang18
Ausgabenummer2
DOIs
PublikationsstatusVeröffentlicht - 2018

ASJC Scopus subject areas

  • !!Materials Science(all)

Fields of Expertise

  • Advanced Materials Science

Treatment code (Nähere Zuordnung)

  • Basic - Fundamental (Grundlagenforschung)

Dies zitieren

Intermetallic Compound and Void Kinetics Extraction From Resistance Evolution in Copper Pillars During Electromigration Stress Tests. / Hartler, C.; Moreau, S.; Chery, E.; Charbonnier, J.; Siegert, J.; Plihon, A.; Assous, M.; Mitsche, Stefan; Simic, Sanja; Schrank, F.; Grogger, Werner.

in: IEEE Transactions on Device and Materials Reliability, Jahrgang 18, Nr. 2, 17822358, 2018, S. 313-320.

Publikation: Beitrag in einer FachzeitschriftArtikelForschung

Hartler, C. ; Moreau, S. ; Chery, E. ; Charbonnier, J. ; Siegert, J. ; Plihon, A. ; Assous, M. ; Mitsche, Stefan ; Simic, Sanja ; Schrank, F. ; Grogger, Werner. / Intermetallic Compound and Void Kinetics Extraction From Resistance Evolution in Copper Pillars During Electromigration Stress Tests. in: IEEE Transactions on Device and Materials Reliability. 2018 ; Jahrgang 18, Nr. 2. S. 313-320.
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