I-V Method Based PDN Impedance Measurement Technique and Associated Probe Design

Xiaolu Zhu, Ling Zhang, Yuandong Guo, Pengyu Wei, Richard Zai, James Drewniak, David Pommerenke

Publikation: Beitrag in Buch/Bericht/KonferenzbandBeitrag in einem Konferenzband

Abstract

In this paper I-V method-based impedance measurement of power distribution network (PDN) in printed circuit board (PCB) technique is proposed and compared to the traditional VNA method [1]. A I-V method-based probe is designed and verified by comparing the performance with VNA method. To de-embed the parasitic problems, a special I-V probe calibration method is created according to the characteristics of the probe.

Originalspracheenglisch
Titel2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019
Herausgeber (Verlag)Institute of Electrical and Electronics Engineers
Seiten30-33
Seitenumfang4
ISBN (elektronisch)9781538691991
DOIs
PublikationsstatusVeröffentlicht - 1 Jul 2019
Extern publiziertJa
Veranstaltung2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019 - New Orleans, USA / Vereinigte Staaten
Dauer: 22 Jul 201926 Jul 2019

Publikationsreihe

Name2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019

Konferenz

Konferenz2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019
LandUSA / Vereinigte Staaten
OrtNew Orleans
Zeitraum22/07/1926/07/19

ASJC Scopus subject areas

  • !!Signal Processing
  • !!Energy Engineering and Power Technology
  • !!Electrical and Electronic Engineering
  • !!Safety, Risk, Reliability and Quality

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