High temperature metallic melts - resistivity intercomparison for space applications

Claus Cagran, Thomas Hüpf, Gernot Pottlacher, G. Lohöfer

Publikation: Beitrag in Buch/Bericht/KonferenzbandBeitrag in einem KonferenzbandForschungBegutachtung

Originalspracheenglisch
TitelInternational Symposium on Temperature and Thermal Measurements in Industry and Science
Herausgeber (Verlag).
Seiten7-7
PublikationsstatusVeröffentlicht - 2007
VeranstaltungInternational Symposium on Temperature and Thermal Measurements in Industry and Science - Lake Louise, Kanada
Dauer: 21 Mai 200725 Mai 2007

Konferenz

KonferenzInternational Symposium on Temperature and Thermal Measurements in Industry and Science
LandKanada
OrtLake Louise
Zeitraum21/05/0725/05/07

Dies zitieren

Cagran, C., Hüpf, T., Pottlacher, G., & Lohöfer, G. (2007). High temperature metallic melts - resistivity intercomparison for space applications. in International Symposium on Temperature and Thermal Measurements in Industry and Science (S. 7-7). ..

High temperature metallic melts - resistivity intercomparison for space applications. / Cagran, Claus; Hüpf, Thomas; Pottlacher, Gernot; Lohöfer, G.

International Symposium on Temperature and Thermal Measurements in Industry and Science. ., 2007. S. 7-7.

Publikation: Beitrag in Buch/Bericht/KonferenzbandBeitrag in einem KonferenzbandForschungBegutachtung

Cagran, C, Hüpf, T, Pottlacher, G & Lohöfer, G 2007, High temperature metallic melts - resistivity intercomparison for space applications. in International Symposium on Temperature and Thermal Measurements in Industry and Science. ., S. 7-7, Lake Louise, Kanada, 21/05/07.
Cagran C, Hüpf T, Pottlacher G, Lohöfer G. High temperature metallic melts - resistivity intercomparison for space applications. in International Symposium on Temperature and Thermal Measurements in Industry and Science. . 2007. S. 7-7
Cagran, Claus ; Hüpf, Thomas ; Pottlacher, Gernot ; Lohöfer, G. / High temperature metallic melts - resistivity intercomparison for space applications. International Symposium on Temperature and Thermal Measurements in Industry and Science. ., 2007. S. 7-7
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