ESD susceptibility evaluation on capacitive fingerprint module

Pengyu Wei, Shubhankar Marathe, Jianchi Zhou, David Pommerenke

Publikation: Beitrag in Buch/Bericht/KonferenzbandBeitrag in einem Konferenzband

Abstract

This paper reports on an investigation of ESD stresses on a fingerprint module. It shows that sparking to the flex connector, dielectric breakdown of the insulating layers, and transient electric and magnetic fields can cause damage. Test methods and simulation models are shown. An ESD generator and ESD field probe were used to expose the fingerprint module to currents and electromagnetic fields. Breakdown of the top insulating layer was observed. Damage due to ESD induced H-field injection occurred A 1 kŌ resistively grounded ring is proposed as an ESD protection solution for the fingerprint module system. Its effect on the discharge current is shown via simulation.

Originalspracheenglisch
Titel2017 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMCSI 2017 - Proceedings
Herausgeber (Verlag)Institute of Electrical and Electronics Engineers
Seiten175-180
Seitenumfang6
ISBN (elektronisch)9781538622308
DOIs
PublikationsstatusVeröffentlicht - 20 Okt 2017
Extern publiziertJa
Veranstaltung2017 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMCSI 2017 - Washington, USA / Vereinigte Staaten
Dauer: 7 Aug 201711 Aug 2017

Publikationsreihe

NameIEEE International Symposium on Electromagnetic Compatibility
ISSN (Print)1077-4076
ISSN (elektronisch)2158-1118

Konferenz

Konferenz2017 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMCSI 2017
LandUSA / Vereinigte Staaten
OrtWashington
Zeitraum7/08/1711/08/17

ASJC Scopus subject areas

  • !!Condensed Matter Physics
  • !!Electrical and Electronic Engineering

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