ESD field coupling study in relation with PCB GND and metal chassis

Jong Sung Lee, David Pommerenke, Jae Deok Lim, Byong Su Seol

Publikation: Beitrag in Buch/Bericht/KonferenzbandBeitrag in einem Konferenzband

Abstract

This work demonstrates a simple experimental setup to measure ESD-induced voltage to traces on a printed circuit board when ESD current is injected directly onto the outside of a metal case and presents how the induced voltage can be affected by the physical structure of the PCB ground and the metal case. The correlation between ESD-induced voltage and the method of connecting the PCB and chassis grounds shall be discussed, as well as how the PCB ground fill affects ESD. These experimental results may provide guidance for a better design for ESD immunity.

Originalspracheenglisch
TitelProceedings of the 20th International Zurich Symposium on Electromagnetic Compatibility, EMC Zurich 2009
Seiten153-156
Seitenumfang4
DOIs
PublikationsstatusVeröffentlicht - 16 Apr 2009
Extern publiziertJa
Veranstaltung20th International Zurich Symposium on Electromagnetic Compatibility: EMC Zurich 2009 - Zurich, Schweiz
Dauer: 12 Jan 200916 Jan 2009

Publikationsreihe

NameProceedings of the 20th International Zurich Symposium on Electromagnetic Compatibility, EMC Zurich 2009

Konferenz

Konferenz20th International Zurich Symposium on Electromagnetic Compatibility
LandSchweiz
OrtZurich
Zeitraum12/01/0916/01/09

ASJC Scopus subject areas

  • !!Electrical and Electronic Engineering

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