EMI coupling paths in silicon optical sub-assembly package

Jing Li, Xiao Li, Xiangyang Jiao, Sukhjinder Toor, Ling Zhang, Alpesh Bhobe, James Drewniak, David Pommerenke

Publikation: Beitrag in Buch/Bericht/KonferenzbandBeitrag in einem Konferenzband

Abstract

Optical transceiver modules are commonly used in telecommunication and data communications systems. These modules, which are located in the optical I/O ports at the front-end of switches and routers, are a dominating source of electromagnetic interference (EMI) problems at their operation frequency and/or harmonics. In this study, a simulation model is used to investigate the EMI coupling physics and performance of the silicon optical sub-assembly (OSA) module. Total radiation power (TRP) measurement has also been performed in a mode-stirred reverberation chamber (RC) to support the radiation mechanism analysis. The connector between the module circuit board to flex cable has been identified as the major EMI source above 15 GHz in the OSA module. This conclusion can help provide insight to EMC design engineers about the potential EMI problems in the OSA package.

Originalspracheenglisch
Titel2016 IEEE International Symposium on Electromagnetic Compatibility, EMC 2016
Herausgeber (Verlag)Institute of Electrical and Electronics Engineers
Seiten890-895
Seitenumfang6
ISBN (elektronisch)9781509014415
DOIs
PublikationsstatusVeröffentlicht - 19 Sep 2016
Extern publiziertJa
Veranstaltung2016 IEEE International Symposium on Electromagnetic Compatibility, EMC 2016 - Ottawa, Kanada
Dauer: 25 Jul 201629 Jul 2016

Publikationsreihe

NameIEEE International Symposium on Electromagnetic Compatibility
Band2016-September
ISSN (Print)1077-4076
ISSN (elektronisch)2158-1118

Konferenz

Konferenz2016 IEEE International Symposium on Electromagnetic Compatibility, EMC 2016
LandKanada
OrtOttawa
Zeitraum25/07/1629/07/16

ASJC Scopus subject areas

  • !!Condensed Matter Physics
  • !!Electrical and Electronic Engineering

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