Embedded Suspended Stripline Substrate Technology (ESSS) as a Catalyst for Low-loss PCB Structures in the Ka-Band

Sebastian Sattler; Ahmad Bader Alothman Alterkawi; Fabrizio Gentili; Reinhard Teschl; Erich Schlaffer; Bernhard Reitmaier; Wolfgang Bösch

Embedded Suspended Stripline Substrate Technology (ESSS) as a Catalyst for Low-loss PCB Structures in the Ka-Band

Sebastian Sattler, Ahmad Bader Alothman Alterkawi, Fabrizio Gentili, Reinhard Teschl, Erich Schlaffer, Bernhard Reitmaier, Wolfgang Bösch

Institut für Hochfrequenztechnik (4510)

Publikation: Beitrag in Buch/Bericht/Konferenzband › Beitrag in einem Konferenzband › Begutachtung

Originalsprache	englisch
Titel	2019 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP)
Publikationsstatus	Veröffentlicht - 2019

Fields of Expertise

Information, Communication & Computing

Dieses zitieren

Embedded Suspended Stripline Substrate Technology (ESSS) as a Catalyst for Low-loss PCB Structures in the Ka-Band. / Sattler, Sebastian; Alothman Alterkawi, Ahmad Bader; Gentili, Fabrizio et al.
2019 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP). 2019.

Publikation: Beitrag in Buch/Bericht/Konferenzband › Beitrag in einem Konferenzband › Begutachtung

@inproceedings{110ec14ee217493588ad1af7957d7142,

title = "Embedded Suspended Stripline Substrate Technology (ESSS) as a Catalyst for Low-loss PCB Structures in the Ka-Band",

author = "Sebastian Sattler and {Alothman Alterkawi}, {Ahmad Bader} and Fabrizio Gentili and Reinhard Teschl and Erich Schlaffer and Bernhard Reitmaier and Wolfgang B{\"o}sch",

year = "2019",

language = "English",

booktitle = "2019 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP)",

}

TY - GEN

T1 - Embedded Suspended Stripline Substrate Technology (ESSS) as a Catalyst for Low-loss PCB Structures in the Ka-Band

AU - Sattler, Sebastian

AU - Alothman Alterkawi, Ahmad Bader

AU - Gentili, Fabrizio

AU - Teschl, Reinhard

AU - Schlaffer, Erich

AU - Reitmaier, Bernhard

AU - Bösch, Wolfgang

PY - 2019

Y1 - 2019

M3 - Conference paper

BT - 2019 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP)

ER -