Electromagnetic Emission Scanning at the Surface of ICs

Bernd Deutschmann, Andreas Gleinser, Philipp Reitter

Publikation: Beitrag in Buch/Bericht/KonferenzbandBeitrag in einem Konferenzband

Abstract

With increasing density of components in modern ICs, their electromagnetic compatibility (EMC) becomes more and more a design factor to consider. A lot of interference problems of electronic systems originate form high electromagnetic emission and low immunity of the used ICs. The so-called surface scan method provides a useful measurement technique to highlight origins of emissions
directly at the surface of IC packages or microchips. It is based on measuring electric- as well as magnetic near fields at the surface of ICs by automatically
moving a probe in 3 axis over the device. This technique enables the visualization of the distribution of E- and Hfields emitting from the surface of the device and thereby helps to identify and analyze emission hotspots.
Originalspracheenglisch
Titel15. EMV-Fachtagung
UntertitelOVE Schriftenreihe Nr. 87
Redakteure/-innenGunter Winkler
ErscheinungsortWien
Herausgeber (Verlag)Österreichischer Verband für Elektrotechnik
Seiten16
Seitenumfang1
Band87
ISBN (Print)3-85133-093-5
PublikationsstatusVeröffentlicht - 26 Apr 2017

Schlagwörter

  • ESD, Wunsch Bell Charakterisitk, EMV, transient disturbance

ASJC Scopus subject areas

  • !!Engineering(all)

Fields of Expertise

  • Information, Communication & Computing

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  • Dieses zitieren

    Deutschmann, B., Gleinser, A., & Reitter, P. (2017). Electromagnetic Emission Scanning at the Surface of ICs. in G. Winkler (Hrsg.), 15. EMV-Fachtagung: OVE Schriftenreihe Nr. 87 (Band 87, S. 16). Wien: Österreichischer Verband für Elektrotechnik.