Comparison of BBSPICE to PEEC Equivalent Circuit Models for Simulation of Floating PCB above Ground Plane

Publikation: Beitrag in Buch/Bericht/KonferenzbandBeitrag in einem KonferenzbandBegutachtung

Abstract

Floating, i.e. not locally grounded, printed circuit boards (PCBs) at the end of a long harness and above a large ground plane are common in automotive applications. A problem in modeling such setups is the missing ground reference at the PCB side. In this work, two equivalent circuit models are extracted from PCB design data, one based on a broadband SPICE (BBSPICE) netlist generated from S-parameter simulation and the other obtained by partial element equivalent circuit (PEEC) method. They are compared against measurements results of a demonstrator PCB in above described setup. Investigations include the verification of both modeling approaches with respect to low frequency behavior, broadbandness, sensitivity to PCB circuitry modifications and grounding scheme, as well as model generation effort and simulation times.

Originalspracheenglisch
Titel 2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE
Herausgeber (Verlag)Institute of Electrical and Electronics Engineers
Seiten19-24
Seitenumfang6
ISBN (elektronisch)9781728105932
DOIs
PublikationsstatusVeröffentlicht - 1 Sep. 2019
Veranstaltung2019 International Symposium on Electromagnetic Compatibility: EMC Europe 2019 - Barcelona, Spanien
Dauer: 2 Sep. 20196 Sep. 2019

Publikationsreihe

NameEMC Europe 2019 - 2019 International Symposium on Electromagnetic Compatibility

Konferenz

Konferenz2019 International Symposium on Electromagnetic Compatibility
KurztitelEMC Europe 2019
Land/GebietSpanien
OrtBarcelona
Zeitraum2/09/196/09/19

ASJC Scopus subject areas

  • Energieanlagenbau und Kraftwerkstechnik
  • Elektrotechnik und Elektronik
  • Instrumentierung
  • Strahlung

Fields of Expertise

  • Information, Communication & Computing

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