Commercial USB IC Soft-Failure Sensitivity Measurement Method and Trend Analysis

Runbing Hua, Omid Hoseini Izadi, Zhekun Peng, Hideki Shumiya, Shota Konno, Kenji Araki, David Johannes Pommerenke, DongHyun Kim

Publikation: Beitrag in Buch/Bericht/KonferenzbandBeitrag in einem Konferenzband

Abstract

An electrostatic discharge (ESD) happening on a commercial electronic device such as at the USB interface can induce soft-failure in the IC and disturb the normal operation of the device. This paper investigates the soft-failure behaviors of 14 commercial USB devices in order to obtain an insight into the overall sensitivity trend of such systems and into the severity of different soft-failures. A new analysis method is proposed in this paper. The considered parameters in this study include: injected pulse widths, pulse rise time, current levels, USB standard of the DUTS, etc. Soft-failures started to occur at a current of around 1 A, and nearly all configurations would show errors above 6 A.
Originalspracheenglisch
Titel2020 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2020
Seiten200-204
Seitenumfang5
ISBN (elektronisch)978-1-7281-7430-3
DOIs
PublikationsstatusVeröffentlicht - Jul 2020
Veranstaltung 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity: EMCSI 2020 - Virtuell, USA / Vereinigte Staaten
Dauer: 18 Jul 202020 Jul 2020

Konferenz

Konferenz 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity
KurztitelEMCSI 2020
LandUSA / Vereinigte Staaten
OrtVirtuell
Zeitraum18/07/2020/07/20

ASJC Scopus subject areas

  • !!Information Systems and Management
  • !!Safety, Risk, Reliability and Quality
  • !!Signal Processing
  • !!Radiation
  • !!Electrical and Electronic Engineering

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