Characterizing package/PCB PDN interactions from a full-wave finite-difference formulation

Shishuang Sun*, David Pommerenke, James Drewniak, Kai Xiao, Sin Ting Chen, Tzong Lin Wu

*Korrespondierende/r Autor/in für diese Arbeit

Publikation: Beitrag in Buch/Bericht/KonferenzbandBeitrag in einem Konferenzband

Abstract

A novel approach of equivalent circuit model extraction is developed for modeling of integrated package and PCB power distribution networks (PDN). The integrated PDNs are formulated from a full-wave finite-difference algorithm, and the resulting matrix equations are converted to equivalent circuits. The equivalent circuits, as well as the decoupling capacitors and the attached circuit components, can be analyzed with a SPICE-like solver in both the time and frequency domains. The modeling of dielectric loss is also addressed. The method is used to model three PDN problems including a simple power bus, a BGA package mounting on a PCB, and a 3-D power bus structure. The results are compared to either measurement data or other numerical results. The limitations of the method are also discussed.

Originalspracheenglisch
Titel2006 IEEE International Symposium on Electromagnetic Compatibility, EMC 2006
Seiten550-555
Seitenumfang6
PublikationsstatusVeröffentlicht - 1 Dez 2006
Extern publiziertJa
Veranstaltung2006 IEEE International Symposium on Electromagnetic Compatibility: EMC 2006 - Portland, USA / Vereinigte Staaten
Dauer: 14 Aug 200618 Aug 2006

Publikationsreihe

NameIEEE International Symposium on Electromagnetic Compatibility
Band2
ISSN (Print)1077-4076

Konferenz

Konferenz2006 IEEE International Symposium on Electromagnetic Compatibility
LandUSA / Vereinigte Staaten
OrtPortland
Zeitraum14/08/0618/08/06

ASJC Scopus subject areas

  • !!Condensed Matter Physics
  • !!Electrical and Electronic Engineering

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