Characterization of Moisture Uptake in Microelectronics Packaging Materials

Fabian Huber, Harald Etschmaier, Archim Wolfberger, Anderson Singulani, Peter Hadley

Publikation: Beitrag in Buch/Bericht/KonferenzbandBeitrag in einem KonferenzbandForschungBegutachtung

Abstract

Moisture uptake of materials, used in optoelectronic sensor packaging for the purpose of component attach or for encapsulation, is investigated. The diffusion behavior of these mostly epoxide-based polymer compounds is characterized under various temperature and humidity loads and described using analytical models. The water uptake during soak tests was determined and the data can be fit assuming multistep diffusion behavior. It is assumed that this behavior can be assigned to the formation of hydrogen bonds and moisture absorption in the free volume of the polymer matrix [1]. To investigate this assumption further, in addition to gravimetric methods, the evolution of the O-H stretch modes are measured by Attenuated Total Reflection Fourier Transform Infrared Spectroscopy (ATR-FTIR).

Originalspracheenglisch
Titel2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings
Herausgeber (Verlag)Institute of Electrical and Electronics Engineers
ISBN (elektronisch)9781538668139
DOIs
PublikationsstatusVeröffentlicht - 26 Nov 2018
Extern publiziertJa
Veranstaltung7th Electronic System-Integration Technology Conference - Dresden, Deutschland
Dauer: 18 Sep 201821 Sep 2018

Konferenz

Konferenz7th Electronic System-Integration Technology Conference
KurztitelSTC 2018
LandDeutschland
OrtDresden
Zeitraum18/09/1821/09/18

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Schlagwörter

    ASJC Scopus subject areas

    • !!Hardware and Architecture
    • !!Electrical and Electronic Engineering
    • !!Electronic, Optical and Magnetic Materials

    Dieses zitieren

    Huber, F., Etschmaier, H., Wolfberger, A., Singulani, A., & Hadley, P. (2018). Characterization of Moisture Uptake in Microelectronics Packaging Materials. in 2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings [8546489] Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/ESTC.2018.8546489