Anticipating EMI and on-board interference in automotive platforms

Shishuang Sun*, Geping Liu, David J. Pommerenke, James L. Drewniak, Richard W. Kautz, Chingchi Chen

*Korrespondierende/r Autor/in für diese Arbeit

Publikation: Beitrag in einer FachzeitschriftKonferenzartikel

Abstract

A dual-step MTL / FDTD strategy is proposed for anticipating full-vehicle level EMI. In the first step, the current distribution along a cable bundle connecting to electronic modules an an automotive platform is calculated using multi-conductor transmission-line (MTL) models. In order to account for common-mode discontinuities on the vehicle chassis, e.g., slots, 3D full-wave modeling (FDTD) is used to determine radiation impedances, which are thereafter incorporated in the MTL models for compensating the radiation power loss. In the second step, the obtained currents are implemented as impressed current sources in full-vehicle full-wave modeling using an FDTD multi-wire subcelluar algorithm. Thus, the full-vehicle emissions from the automotive harness and the common-mode discontinuities of the vehicle chassis can be predicted. The effectiveness and limitation of this approach have been demonstrated in a controlled laboratory environment.

Originalspracheenglisch
Seiten (von - bis)792-797
Seitenumfang6
FachzeitschriftIEEE International Symposium on Electromagnetic Compatibility
Jahrgang3
PublikationsstatusVeröffentlicht - 8 Okt 2004
Extern publiziertJa
Veranstaltung2004 International Symposium on Electromagnetic Compatibility, EMC 2004 - Santa Clara, CA, USA / Vereinigte Staaten
Dauer: 9 Aug 200413 Aug 2004

ASJC Scopus subject areas

  • !!Condensed Matter Physics
  • !!Electrical and Electronic Engineering

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