Analyses and Modeling of a Wet-Chemical-Etch Process on Rotating Silicon Wafers with an Impinging Etchant Jet

Felix Staudegger, Michael Hofbaur, Hans-Jürgen Kruwinus

Publikation: Beitrag in einer FachzeitschriftArtikelForschungBegutachtung

Originalspracheenglisch
Seiten (von - bis)H340-H345
FachzeitschriftJournal of the Electrochemical Society
Jahrgang156
Ausgabenummer5
PublikationsstatusVeröffentlicht - 2009

Treatment code (Nähere Zuordnung)

  • Basic - Fundamental (Grundlagenforschung)
  • Experimental

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Analyses and Modeling of a Wet-Chemical-Etch Process on Rotating Silicon Wafers with an Impinging Etchant Jet. / Staudegger, Felix; Hofbaur, Michael; Kruwinus, Hans-Jürgen.

in: Journal of the Electrochemical Society, Jahrgang 156, Nr. 5, 2009, S. H340-H345.

Publikation: Beitrag in einer FachzeitschriftArtikelForschungBegutachtung

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AU - Staudegger, Felix

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AU - Kruwinus, Hans-Jürgen

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