Analyses and Modeling of a Wet-Chemical-Etch Process on Rotating Silicon Wafers with an Impinging Etchant Jet

Felix Staudegger, Michael Hofbaur, Hans-Jürgen Kruwinus

Publikation: Beitrag in einer Fachzeitschrift › Artikel › Begutachtung

Originalsprache	englisch
Seiten (von - bis)	H340-H345
Fachzeitschrift	Journal of the Electrochemical Society
Jahrgang	156
Ausgabenummer	5
Publikationsstatus	Veröffentlicht - 2009

Treatment code (Nähere Zuordnung)

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title = "Analyses and Modeling of a Wet-Chemical-Etch Process on Rotating Silicon Wafers with an Impinging Etchant Jet",

author = "Felix Staudegger and Michael Hofbaur and Hans-J{\"u}rgen Kruwinus",

year = "2009",

language = "English",

volume = "156",

pages = "H340--H345",

journal = "Journal of the Electrochemical Society",

publisher = "Electrochemical Society, Inc.",

number = "5",

}

TY - JOUR

T1 - Analyses and Modeling of a Wet-Chemical-Etch Process on Rotating Silicon Wafers with an Impinging Etchant Jet

AU - Staudegger, Felix

AU - Hofbaur, Michael

AU - Kruwinus, Hans-Jürgen

PY - 2009

Y1 - 2009

UR - http://www.ecsdl.org/JES/

M3 - Article

VL - 156

SP - H340-H345

JO - Journal of the Electrochemical Society

JF - Journal of the Electrochemical Society

IS - 5

ER -