An Extended EDMR Setup for SiC Defect Characterization

Gernot Gruber, Markus Koch, Gregor Pobegen, Michael Nelhiebel, Peter Hadley

Publikation: Beitrag in Buch/Bericht/KonferenzbandBeitrag in einem KonferenzbandForschungBegutachtung

Originalsprachedeutsch
TitelSilicon Carbide and Related Materials 2012
Herausgeber (Verlag)Trans Tech Publications Ltd.
Seiten365-368
ISBN (Print)978-3-03785-624-6
PublikationsstatusVeröffentlicht - 2013
VeranstaltungEuropean Conference on Silicon Carbide and Related Materials 2012 - St. Petersburg, Russland
Dauer: 2 Sep 20126 Sep 2012

Konferenz

KonferenzEuropean Conference on Silicon Carbide and Related Materials 2012
LandRussland
OrtSt. Petersburg
Zeitraum2/09/126/09/12

Fields of Expertise

  • Advanced Materials Science

Treatment code (Nähere Zuordnung)

  • Experimental

Dies zitieren

Gruber, G., Koch, M., Pobegen, G., Nelhiebel, M., & Hadley, P. (2013). An Extended EDMR Setup for SiC Defect Characterization. in Silicon Carbide and Related Materials 2012 (S. 365-368). Trans Tech Publications Ltd..

An Extended EDMR Setup for SiC Defect Characterization. / Gruber, Gernot; Koch, Markus; Pobegen, Gregor; Nelhiebel, Michael; Hadley, Peter.

Silicon Carbide and Related Materials 2012. Trans Tech Publications Ltd., 2013. S. 365-368.

Publikation: Beitrag in Buch/Bericht/KonferenzbandBeitrag in einem KonferenzbandForschungBegutachtung

Gruber, G, Koch, M, Pobegen, G, Nelhiebel, M & Hadley, P 2013, An Extended EDMR Setup for SiC Defect Characterization. in Silicon Carbide and Related Materials 2012. Trans Tech Publications Ltd., S. 365-368, St. Petersburg, Russland, 2/09/12.
Gruber G, Koch M, Pobegen G, Nelhiebel M, Hadley P. An Extended EDMR Setup for SiC Defect Characterization. in Silicon Carbide and Related Materials 2012. Trans Tech Publications Ltd. 2013. S. 365-368
Gruber, Gernot ; Koch, Markus ; Pobegen, Gregor ; Nelhiebel, Michael ; Hadley, Peter. / An Extended EDMR Setup for SiC Defect Characterization. Silicon Carbide and Related Materials 2012. Trans Tech Publications Ltd., 2013. S. 365-368
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