An application of utilizing the system-efficient-ESD-design (SEED) concept to analyze an LED protection circuit of a cell phone

Tianqi Li*, Junji Maeshima, Hideki Shumiya, David J. Pommerenke, Takashi Yamada, Kenji Araki

*Korrespondierende/r Autor/in für diese Arbeit

Publikation: Beitrag in Buch/Bericht/KonferenzbandBeitrag in einem Konferenzband

Abstract

An LED circuit of a cell phone is analyzed using the System-Efficient-ESD- Design (SEED) methodology [1]. The method allows simulation of the ESD current path, and the interaction mechanisms between the clamp and the on-chip ESD protection circuit. The I-V curve and the non-linear behavior under high current pulses of every component including R, L, C, and ferrite beads are measured and modeled. By combining all of the component models, a complete circuit model is built for predicting the circuit behavior and damaging threshold at a given setting-voltage of a Transmission Line Pulser (TLP).

Originalspracheenglisch
TitelEMC 2012 - 2012 IEEE International Symposium on Electromagnetic Compatibility, Final Program
Seiten346-350
Seitenumfang5
DOIs
PublikationsstatusVeröffentlicht - 12 Dez 2012
Extern publiziertJa
Veranstaltung2012 IEEE International Symposium on Electromagnetic Compatibility, EMC 2012 - Pittsburgh, PA, USA / Vereinigte Staaten
Dauer: 5 Aug 201210 Aug 2012

Publikationsreihe

NameIEEE International Symposium on Electromagnetic Compatibility
ISSN (Print)1077-4076
ISSN (elektronisch)2158-1118

Konferenz

Konferenz2012 IEEE International Symposium on Electromagnetic Compatibility, EMC 2012
LandUSA / Vereinigte Staaten
OrtPittsburgh, PA
Zeitraum5/08/1210/08/12

ASJC Scopus subject areas

  • !!Condensed Matter Physics
  • !!Electrical and Electronic Engineering

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  • Dieses zitieren

    Li, T., Maeshima, J., Shumiya, H., Pommerenke, D. J., Yamada, T., & Araki, K. (2012). An application of utilizing the system-efficient-ESD-design (SEED) concept to analyze an LED protection circuit of a cell phone. in EMC 2012 - 2012 IEEE International Symposium on Electromagnetic Compatibility, Final Program (S. 346-350). [6351824] (IEEE International Symposium on Electromagnetic Compatibility). https://doi.org/10.1109/ISEMC.2012.6351824