Acoustic field characterisation of an ultrasonic phased array for a novel flow sensor using an optical microphone

Publikation: Beitrag in Buch/Bericht/KonferenzbandBeitrag in einem KonferenzbandForschungBegutachtung

Originalspracheenglisch
TitelIEEE International Ultrasonics Symposium 2018 Conference Proceedings
Seitenumfang4
DOIs
PublikationsstatusElektronische Veröffentlichung vor Drucklegung. - 20 Dez 2018
VeranstaltungIEEE International Ultrasonics Symposium 2018 - Kobe, Japan
Dauer: 22 Okt 201825 Okt 2018
http://sites.ieee.org/ius-2018/

Konferenz

KonferenzIEEE International Ultrasonics Symposium 2018
LandJapan
OrtKobe
Zeitraum22/10/1825/10/18
Internetadresse

Dies zitieren

Acoustic field characterisation of an ultrasonic phased array for a novel flow sensor using an optical microphone. / Klambauer, Reinhard; Bergmann, Alexander.

IEEE International Ultrasonics Symposium 2018 Conference Proceedings. 2018.

Publikation: Beitrag in Buch/Bericht/KonferenzbandBeitrag in einem KonferenzbandForschungBegutachtung

Klambauer, R & Bergmann, A 2018, Acoustic field characterisation of an ultrasonic phased array for a novel flow sensor using an optical microphone. in IEEE International Ultrasonics Symposium 2018 Conference Proceedings. IEEE International Ultrasonics Symposium 2018, Kobe, Japan, 22/10/18. https://doi.org/10.1109/ULTSYM.2018.8580006
@inproceedings{5de2d25901f24ddbbe65bc20e6bc1a80,
title = "Acoustic field characterisation of an ultrasonic phased array for a novel flow sensor using an optical microphone",
author = "Reinhard Klambauer and Alexander Bergmann",
year = "2018",
month = "12",
day = "20",
doi = "10.1109/ULTSYM.2018.8580006",
language = "English",
booktitle = "IEEE International Ultrasonics Symposium 2018 Conference Proceedings",

}

TY - GEN

T1 - Acoustic field characterisation of an ultrasonic phased array for a novel flow sensor using an optical microphone

AU - Klambauer, Reinhard

AU - Bergmann, Alexander

PY - 2018/12/20

Y1 - 2018/12/20

U2 - 10.1109/ULTSYM.2018.8580006

DO - 10.1109/ULTSYM.2018.8580006

M3 - Conference contribution

BT - IEEE International Ultrasonics Symposium 2018 Conference Proceedings

ER -