A Review of Expansion Measurements for Subsecond Ohmic Pulse-Heating Experiments

Gernot Pottlacher, Thomas Hüpf

Publikation: Beitrag in Buch/Bericht/KonferenzbandBeitrag in Buch/BerichtForschung

Originalspracheenglisch
TitelThermal Conductivity 30 / Thermal Expansion 18
Redakteure/-innenDaniela S. Gaal
Herausgeber (Verlag)DEStech Publications, Inc
Seiten192-206
Auflage1
ISBN (Print)978-1-60595-015-0
PublikationsstatusVeröffentlicht - 2010

Treatment code (Nähere Zuordnung)

  • Basic - Fundamental (Grundlagenforschung)
  • Experimental

Dies zitieren

Pottlacher, G., & Hüpf, T. (2010). A Review of Expansion Measurements for Subsecond Ohmic Pulse-Heating Experiments. in D. S. Gaal (Hrsg.), Thermal Conductivity 30 / Thermal Expansion 18 (1 Aufl., S. 192-206). DEStech Publications, Inc.

A Review of Expansion Measurements for Subsecond Ohmic Pulse-Heating Experiments. / Pottlacher, Gernot; Hüpf, Thomas.

Thermal Conductivity 30 / Thermal Expansion 18. Hrsg. / Daniela S. Gaal. 1. Aufl. DEStech Publications, Inc, 2010. S. 192-206.

Publikation: Beitrag in Buch/Bericht/KonferenzbandBeitrag in Buch/BerichtForschung

Pottlacher, G & Hüpf, T 2010, A Review of Expansion Measurements for Subsecond Ohmic Pulse-Heating Experiments. in DS Gaal (Hrsg.), Thermal Conductivity 30 / Thermal Expansion 18. 1 Aufl., DEStech Publications, Inc, S. 192-206.
Pottlacher G, Hüpf T. A Review of Expansion Measurements for Subsecond Ohmic Pulse-Heating Experiments. in Gaal DS, Hrsg., Thermal Conductivity 30 / Thermal Expansion 18. 1 Aufl. DEStech Publications, Inc. 2010. S. 192-206
Pottlacher, Gernot ; Hüpf, Thomas. / A Review of Expansion Measurements for Subsecond Ohmic Pulse-Heating Experiments. Thermal Conductivity 30 / Thermal Expansion 18. Hrsg. / Daniela S. Gaal. 1. Aufl. DEStech Publications, Inc, 2010. S. 192-206
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