A hybrid approach to decrease port influence in transmission line charaterization

Jianmin Zhang*, David J. Pommerenke, James L. Drewniak, Richard E. DuBroff, Zhiping Yang, Wheling Cheng, John Fisher, Sergio Camerlo

*Korrespondierende/r Autor/in für diese Arbeit

Publikation: Beitrag in Buch/Bericht/KonferenzbandBeitrag in einem Konferenzband

Abstract

Characterization and models for multi-gigabit signaling is an important issue in modern digital system. A good physical based model relies on a precise characterization of the test board. Typically, the characterization of the test board is associated with scattering matrix parameter measurement, which can be done with a VNA (Vector Network Analyzer) in the frequency-domain or a TDR (Time Domain Reflectometer) in the time-domain. The commonly used launch techniques on PCBs (Printed Circuit Boards) associated with the VNA or TDR measurement in the microwave frequency range use SMA or 3.5 mm connectors, in edge-launch or vertical-launch fashions. The transition between the launch port and the DUT (Device Under Test) introduces errors in the measurement. Embedding/deembedding techniques are used to remove the port influences in the measurement generally. For example, TRL (Through, Reflect, and Line) calibration is the typical method used in measurement to eliminate port influences. However, extra test kits are needed for TRL calibration, and furthermore the TRL calibration is sometimes difficult to implement, such as in coupled differential lines. In this paper, an effective hybrid approach for transmission line characterization is proposed, which includes choosing a suitable port launch technique for the test board, port parasitic parameters estimation, and building up a proper circuit model for evaluation with genetic algorithms (GA).

Originalspracheenglisch
Titel2005 International Symposium on Electromagnetic Compatibility, EMC 2005
Seiten684-689
Seitenumfang6
DOIs
PublikationsstatusVeröffentlicht - 1 Dez 2005
Extern publiziertJa
Veranstaltung2005 International Symposium on Electromagnetic Compatibility: EMC 2005 - Chicago, USA / Vereinigte Staaten
Dauer: 8 Aug 200512 Aug 2005

Publikationsreihe

NameIEEE International Symposium on Electromagnetic Compatibility
Band3
ISSN (Print)1077-4076

Konferenz

Konferenz2005 International Symposium on Electromagnetic Compatibility
LandUSA / Vereinigte Staaten
OrtChicago
Zeitraum8/08/0512/08/05

ASJC Scopus subject areas

  • !!Condensed Matter Physics
  • !!Electrical and Electronic Engineering

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