A comparison of different counting methods for a holographic particle counter: Designs, validations and results

Georg Brunnhofer*, Isabella Hinterleitner, Alexander Bergmann, Martin Kraft

*Korrespondierende/r Autor/in für diese Arbeit

    Publikation: Beitrag in einer FachzeitschriftArtikel

    Abstract

    Digital Inline Holography (DIH) is used in many fields of Three-Dimensional (3D) imaging to locate micro or nano-particles in a volume and determine their size, shape or trajectories. A variety of different wavefront reconstruction approaches have been developed for 3D profiling and tracking to study particles’ morphology or visualize flow fields. The novel application of Holographic Particle Counters (HPCs) requires observing particle densities in a given sampling volume which does not strictly necessitate the reconstruction of particles. Such typically spherical objects yield circular intereference patterns—also referred to as fringe patterns—at the hologram plane which can be detected by simpler Two-Dimensional (2D) image processing means. The determination of particle number concentrations (number of particles/unit volume [#/cm3]) may therefore be based on the counting of fringe patterns at the hologram plane. In this work, we explain the nature of fringe patterns and extract the most relevant features provided at the hologram plane. The features aid the identification and selection of suitable pattern recognition techniques and its parameterization. We then present three different techniques which are customized for the detection and counting of fringe patterns and compare them in terms of detection performance and computational speed.

    Originalspracheenglisch
    Aufsatznummer3006
    FachzeitschriftSensors (Switzerland)
    Jahrgang20
    Ausgabenummer10
    DOIs
    PublikationsstatusVeröffentlicht - 2 Mai 2020

    ASJC Scopus subject areas

    • Analytische Chemie
    • !!Biochemistry
    • !!Atomic and Molecular Physics, and Optics
    • !!Instrumentation
    • !!Electrical and Electronic Engineering

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