TY - GEN
T1 - 3D Printed Multilayer Microwave Absorber
AU - Zhang, Wei
AU - Mi, Rui
AU - Khilkevich, Victor
PY - 2022/8/5
Y1 - 2022/8/5
N2 - This paper explores the possibility to create 3D printed multilayer electromagnetic absorbers. The proposed design is similar to the thin-film filters used in optics and consists of interleaving high and low permittivity layers. Based on transmission line theory, the multilayer absorber can be designed in a circuit simulator. Analytical equations, circuit simulations, and measurements are used to analyze and validate the designed absorber. Multilayer absorbers based on 3D printed material can be an inexpensive option for engineering usage with great design flexibility and fast fabrication.
AB - This paper explores the possibility to create 3D printed multilayer electromagnetic absorbers. The proposed design is similar to the thin-film filters used in optics and consists of interleaving high and low permittivity layers. Based on transmission line theory, the multilayer absorber can be designed in a circuit simulator. Analytical equations, circuit simulations, and measurements are used to analyze and validate the designed absorber. Multilayer absorbers based on 3D printed material can be an inexpensive option for engineering usage with great design flexibility and fast fabrication.
KW - Microwave measurement
KW - Three-dimensional displays
KW - Permittivity measurement
KW - Circuit simulation
KW - Nonhomogeneous media
KW - Transmission line measurements
KW - Microwave theory and techniques
KW - multi-layer absorber
KW - transmission line theory
KW - 3D printed material
KW - Microwave absorber
UR - http://www.scopus.com/inward/record.url?scp=85140832389&partnerID=8YFLogxK
U2 - 10.1109/EMCSI39492.2022.9889603
DO - 10.1109/EMCSI39492.2022.9889603
M3 - Conference paper
SN - 978-1-6654-0930-8
T3 - 2022 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2022
SP - 59
EP - 63
BT - 2022 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2022
PB - ACM/IEEE
T2 - 2022 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity
Y2 - 1 August 2022 through 5 August 2022
ER -