3D Integration of MEMS and IC: Design, Technology and Simulations

Maaike Taklo; Kari Schjølberg-Henriksen; Nicolas Lietaer; Josef Prainsack; Anders Elfving; Josef Weber; Matthias Klein; Peter Schneider; Sven Reitz

doi:10.1007/978-90-481-3807-4

3D Integration of MEMS and IC: Design, Technology and Simulations

Maaike Taklo, Kari Schjølberg-Henriksen, Nicolas Lietaer, Josef Prainsack, Anders Elfving, Josef Weber, Matthias Klein, Peter Schneider, Sven Reitz

Institut für Signalverarbeitung und Sprachkommunikation (4420)

Publikation: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Buch/Bericht

Originalsprache	englisch
Titel	Advanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators
Herausgeber (Verlag)	Springer Netherlands
Seiten	191-203
Band	3
Auflage	1
ISBN (Print)	978-90-481-3805-0
DOIs	https://doi.org/10.1007/978-90-481-3807-4
Publikationsstatus	Veröffentlicht - 2010

Publikationsreihe

Name	NATO Science for Peace and Security Series B: Physics and Biophysics
Herausgeber (Verlag)	Springer Netherlands

Treatment code (Nähere Zuordnung)

Application

Zugriff auf Dokument

10.1007/978-90-481-3807-4

Dieses zitieren

Taklo, M., Schjølberg-Henriksen, K., Lietaer, N., Prainsack, J., Elfving, A., Weber, J., Klein, M., Schneider, P., & Reitz, S. (2010). 3D Integration of MEMS and IC: Design, Technology and Simulations. in Advanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators (1 Aufl., Band 3, S. 191-203). (NATO Science for Peace and Security Series B: Physics and Biophysics). Springer Netherlands. https://doi.org/10.1007/978-90-481-3807-4

3D Integration of MEMS and IC: Design, Technology and Simulations. / Taklo, Maaike; Schjølberg-Henriksen, Kari; Lietaer, Nicolas et al.
Advanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators. Band 3 1. Aufl. Springer Netherlands, 2010. S. 191-203 (NATO Science for Peace and Security Series B: Physics and Biophysics).

Publikation: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Buch/Bericht

Taklo, M, Schjølberg-Henriksen, K, Lietaer, N, Prainsack, J, Elfving, A, Weber, J, Klein, M, Schneider, P & Reitz, S 2010, 3D Integration of MEMS and IC: Design, Technology and Simulations. in Advanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators. 1 Aufl., Bd. 3, NATO Science for Peace and Security Series B: Physics and Biophysics, Springer Netherlands, S. 191-203. https://doi.org/10.1007/978-90-481-3807-4

Taklo M, Schjølberg-Henriksen K, Lietaer N, Prainsack J, Elfving A, Weber J et al. 3D Integration of MEMS and IC: Design, Technology and Simulations. in Advanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators. 1 Aufl. Band 3. Springer Netherlands. 2010. S. 191-203. (NATO Science for Peace and Security Series B: Physics and Biophysics). doi: 10.1007/978-90-481-3807-4

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