Foto von David Johannes Pommerenke

David Johannes Pommerenke

Univ.-Prof. Dipl.-Ing. Dr.-Ing.

1992 …2024

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James Drewniak

  • Missouri University of Science and Technology, Rolla

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Daryl G. Beetner

  • Missouri University of Science and Technology, Rolla

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Victor Khilkevich

  • Missouri University of Science and Technology, Rolla

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Jun Fan

  • Missouri University of Science and Technology, Rolla
  • NCR Corporation
  • Queen Mary University of London, School of Biological and Chemical Sciences

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Shubhankar Marathe

  • Missouri University of Science and Technology, Rolla

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Jianchi Zhou

  • Missouri University of Science and Technology, Rolla

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Abhishek Patnaik

  • Missouri University of Science and Technology, Rolla

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Kenji Araki

  • Sony Corporation

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Javad Meiguni

  • Missouri University of Science and Technology, Rolla
  • Amazon
  • Amazon

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R. Jobava

  • EMCoS Ltd.
  • Ivane Javakhishvili Tbilisi State University
  • Technische Universität Berlin
  • Hewlett-Packard Company
  • IEEE

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Giorgi Maghlakelidze

  • Missouri University of Science and Technology, Rolla
  • Cisco Systems

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Atieh Talebzadeh

  • Missouri University of Science and Technology, Rolla

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Pratik Maheshwari

  • Missouri University of Science and Technology, Rolla
  • Apple Inc.

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Guanghua Li

  • Missouri University of Science and Technology, Rolla

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Satyajeet Shinde

  • Missouri University of Science and Technology, Rolla
  • Apple Inc.

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  • AVM Computersystem Vertriebs GmbH
  • Missouri University of Science and Technology, Rolla

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Wei Huang

  • ESDEMC Technology LLC
  • Missouri University of Science and Technology, Rolla
  • University of Missouri

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Hideki Shumiya

  • Sony Corporation

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Giorgi Muchaidze

  • Amber Precision Instruments
  • Missouri University of Science and Technology, Rolla
  • Precision Instruments

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Sen Yang

  • Missouri University of Science and Technology, Rolla
  • Apple Inc.

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Ahmad Hosseinbeig

  • Missouri University of Science and Technology, Rolla
  • Apple Inc.

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J. Lee

  • Samsung Group
  • Missouri University of Science and Technology, Rolla

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R. Zaridze

  • Ivane Javakhishvili Tbilisi State University
  • IEEE
  • Technische Universität Berlin

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Jayong Koo

  • Intel Corporation
  • Missouri University of Science and Technology, Rolla

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Harald Gossner

  • Intel Deutschland GmbH
  • Intel Mobile Communications

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Stephan Frei

  • Technische Universität Dortmund
  • AG Bordsysteme
  • Hewlett-Packard Company
  • Technische Universität Berlin
  • Ivane Javakhishvili Tbilisi State University

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Jin Min

  • Amber Precision Instruments
  • Precision Instruments
  • Missouri University of Science and Technology, Rolla

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David Karkashadze

  • EMCoS Ltd.
  • Ivane Javakhishvili Tbilisi State University
  • IEEE
  • Technische Universität Berlin

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Genda Chen

  • Missouri University of Science and Technology, Rolla

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Steffen Holland

  • Nexperia Germany GmbH
  • Missouri University of Science and Technology, Hamburg

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Kaustav Ghosh

  • Missouri University of Science and Technology, Rolla
  • Juniper Networks, Inc.

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Junji Maeshima

  • Sony Corporation

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Andriy Radchenko

  • Missouri University of Science and Technology, Rolla

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Xiong Chen

  • Tianjin University
  • Missouri University of Science and Technology, Rolla
  • Xi'an Jiaotong University
  • Chinese University of Hong Kong

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Thomas Van Doren

  • Missouri University of Science and Technology, Rolla

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Byong Su Seol

  • Samsung Group
  • Missouri University of Science and Technology, Rolla

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Hossein Rezaei

  • Missouri University of Science and Technology, Rolla

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Keong W. Kam

  • Missouri University of Science and Technology, Rolla
  • University of Missouri

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Pengyu Wei

  • Missouri University of Science and Technology, Rolla
  • Microsoft Corp.
  • Amazon

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Marina Koledintseva

  • Oracle Corporation
  • Missouri University of Science and Technology, Rolla

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Jiang Xiao

  • Missouri University of Science and Technology, Rolla

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Yang Xu

  • Missouri University of Science and Technology, Rolla

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Wilfried Kalkner

  • Technische Universität Berlin
  • Ivane Javakhishvili Tbilisi State University

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Kai Wang

  • IBM Corporation
  • Intel Corporation
  • Missouri University of Science and Technology, Rolla
  • Central Michigan University
  • Michigan State University

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Wei Zhang

  • Missouri University of Science and Technology, Rolla
  • Technische Universität Graz

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Shishuang Sun

  • Altera Corporation
  • Missouri University of Science and Technology, Rolla
  • EMC Lab

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Tianqi Li

  • Missouri University of Science and Technology, Rolla
  • Apple Inc.

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M. Aidam

  • Technische Universität München
  • Ivane Javakhishvili Tbilisi State University
  • Technische Universität Berlin

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Kai Xiao

  • Missouri University of Science and Technology, Rolla
  • Intel Corporation

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Jing Li

  • Hohai University
  • Juniper Networks, Inc.
  • Missouri University of Science and Technology, Rolla
  • AlbaNova University Center
  • Shanghai Normal University

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Sergej Bub

  • Nexperia Germany GmbH
  • Missouri University of Science and Technology, Hamburg

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Guangyao Shen

  • Missouri University of Science and Technology, Rolla

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P. Shubitidze

  • IEEE
  • Technische Universität Berlin
  • Ivane Javakhishvili Tbilisi State University

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Xin Yan

  • Missouri University of Science and Technology, Rolla

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Philippe Sochoux

  • Juniper Networks, Inc.

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Ji Zhang

  • Missouri University of Science and Technology, Rolla
  • Cisco Systems

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Yaojiang Zhang

  • Huawei
  • Missouri University of Science and Technology, Rolla

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Dazhao Liu

  • Intel Corporation
  • Missouri University of Science and Technology, Rolla
  • Nanchang University

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Morten Soerensen

  • Missouri University of Science and Technology, Rolla
  • Aalborg Universitet

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Qian Liu

  • Juniper Networks, Inc.
  • Missouri University of Science and Technology, Rolla

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Xu Gao

  • Apple Inc.
  • Missouri University of Science and Technology, Rolla

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Li Shen

  • Karl-Franzens-Universität Graz
  • Missouri University of Science and Technology, Rolla

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Chulsoon Hwang

  • Missouri University of Science and Technology, Rolla

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Federico Centola

  • Apple Inc.
  • Missouri University of Science and Technology, Rolla

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Hamed Kajbaf

  • Amber Precision Instruments

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Xue Li Guan

  • Singapur
  • Missouri University of Science and Technology, Rolla

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Ramachandran Chundru

  • Missouri University of Science and Technology, Rolla
  • Texas Instruments

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Yunan Han

  • Missouri University of Science and Technology, Rolla
  • Beijing University of Chemical Technology

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Ki Hyuk Kim

  • Missouri University of Science and Technology, Rolla
  • Samsung Group

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Christoph Keller

  • Robert Bosch GmbH

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Yahong Rosa Zheng

  • Missouri University of Science and Technology, Rolla

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Benjamin J. Orr

  • Missouri University of Science and Technology, Rolla
  • Intel Corporation
  • Intel Mobile Communications

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Reza Zoughi

  • Missouri University of Science and Technology, Rolla

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Ming Yu

  • Chinese University of Hong Kong
  • Southern University of Science and Technology

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Niaz Ahmed

  • Missouri University of Science and Technology, Rolla

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Hermann Aichele

  • Robert Bosch GmbH

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David E. Swenson

  • 3M
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Richard E. Dubroff

  • Missouri University of Science and Technology, Rolla

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Richard Moseley

  • NXP Semiconductors Austria GmbH
  • Freescale Semiconductor

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Jaedeok Lim

  • Samsung Group

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Hongyu Li

  • Missouri University of Science and Technology, Rolla

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Yingjie Gan

  • Wuhan University of Technology
  • Missouri University of Science and Technology, Rolla

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Xiangyang Jiao

  • Cisco Systems
  • Missouri University of Science and Technology, Rolla

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Wei Qian

  • Missouri University of Science and Technology, Rolla

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Douglas White

  • Cisco Systems

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Yaochao Yang

  • Cisco Systems

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Zhen Li

  • Missouri University of Science and Technology, Rolla
  • Juniper Networks, Inc.
  • Semtech
  • Aerospace Information Research Institute

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Chong Ding

  • Cisco Systems

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Jacques Rollin

  • Juniper Networks, Inc.

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Hui He

  • Missouri University of Science and Technology, Rolla

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Yongning He

  • Xi'an Jiaotong University

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Mahdi Moradian

  • Amin Nonprofit Higher Education Institute
  • Missouri University of Science and Technology, Rolla

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Argha Nandy

  • Missouri University of Science and Technology, Rolla

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Andy Martwick

  • Intel Corporation

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Suyu Yang

  • Missouri University of Science and Technology, Rolla

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Mohammad Tayeb Ghasr

  • Missouri University of Science and Technology, Rolla

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Seyed Mostafa Mousavi

  • Technische Universität Graz

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Ralf Heinrich

  • Technische Universität Berlin
  • Ivane Javakhishvili Tbilisi State University
  • Hewlett-Packard Company

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Viswa Pilla

  • Missouri University of Science and Technology, Rolla
  • Apple Inc.

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Stephen Scearce

  • Cisco Systems

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Ling Zhang

  • Missouri University of Science and Technology, Rolla
  • Shihezi University

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Xiao-Zhao Li

  • Cisco Systems
  • Missouri University of Science and Technology, Rolla

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Guido Notermans

  • Nexperia Germany GmbH

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Zhiping Yang

  • Cisco Systems
  • Nuova Systems, Inc.
  • Apple Inc.

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Todd Hubing

  • Clemson University
  • Missouri University of Science and Technology, Rolla

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Jianmin Zhang

  • Cisco Systems
  • Missouri University of Science and Technology, Rolla

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A. Orlandi

  • Università degli Studi dell'Aquila

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Takashi Enomoto

  • Sony Corporation

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Lijun Han

  • Garmin International, Inc.
  • Missouri University of Science and Technology, Rolla

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Anna Gheonjian

  • EMCoS Ltd.
  • Ivane Javakhishvili Tbilisi State University

Externe Person

Shaohui Yong

  • Missouri University of Science and Technology, Rolla

Externe Person

Fayu Wan

  • Nanjing University of Information Science and Technology
  • Missouri University of Science and Technology, Rolla

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Qing Cai

  • Missouri University of Science and Technology, Rolla
  • Sprint Nextel

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Ryan McDaniel

  • Ellers Oakley Chester and Rike, Inc.
  • Missouri University of Science and Technology, Rolla

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Gary Hess

  • United Technologies Aerospace Systems
  • Hamilton Sundstrand

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Takashi Yamada

  • Sony Corporation

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Wheling Cheng

  • Juniper Networks, Inc.
  • Cisco Systems

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Zhekun Peng

  • Missouri University of Science and Technology, Rolla

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Shuai Xu

  • Huawei
  • Missouri University of Science and Technology, Rolla

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Fan Zhou

  • Missouri University of Science and Technology, Rolla

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Martin Boettcher

  • Robert Bosch GmbH

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Jiu Sheng Huang

  • Beijing ESD Research Institute
  • Beijing Institute of Electromechanical Technology
  • Missouri University of Science and Technology, Rolla

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Ankit Bhargava

  • University of Missouri
  • Missouri University of Science and Technology, Rolla

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Sergey Kharkovsky

  • University of Western Sydney, School of Engineering
  • Missouri University of Science and Technology, Rolla

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Angela Li

  • Juniper Networks, Inc.

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Peng Shao

  • Firefly Dimension, Inc
  • Missouri University of Science and Technology, Rolla

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Sven Bönisch

  • Technische Universität Berlin

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Scott Herrin

  • Freescale Semiconductor

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K. Tavzarashvili

  • Ivane Javakhishvili Tbilisi State University

Externe Person

Xiang Li

  • Freescale Semiconductor
  • Missouri University of Science and Technology, Rolla
  • Huawei

Externe Person

Fangming Ruan

  • Guizhou University
  • Guizhou Normal University
  • Beijing Oriental Institute of Metrology and Test

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R. Beria

  • Ivane Javakhishvili Tbilisi State University

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Mohamed A. Abou-Khousa

  • Missouri University of Science and Technology, Rolla
  • Robarts Research Institute

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Alpesh U. Bhobe

  • Cisco Systems

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Aniket Bhandare

  • Missouri University of Science and Technology, Rolla

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Geping Liu

  • Altera Corporation
  • Missouri University of Science and Technology, Rolla

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Robert Hoeckele

  • United Technologies Aerospace Systems
  • Hamilton Sundstrand

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H. M. Mu

  • Missouri University of Science and Technology, Rolla

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Ali Foudazi

  • Missouri University of Science and Technology, Rolla

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Kuifeng Hu

  • Agilent Technologies
  • Missouri University of Science and Technology, Rolla

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Runbing Hua

  • Missouri University of Science and Technology, Rolla

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D. Kakulia

  • Ivane Javakhishvili Tbilisi State University

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Mike Hertz

  • Teledyne LeCroy
  • Missouri University of Science and Technology, Rolla

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Kyoungchoul Koo

  • Missouri University of Science and Technology, Rolla

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Dirk R. Eichel

  • Robert Bosch GmbH

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Tun Li

  • Missouri University of Science and Technology, Rolla

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Yuandong Guo

  • Missouri University of Science and Technology, Rolla

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Ken Hall

  • Hewlett-Packard Company

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John Fisher

  • Cisco Systems

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Chunchun Sui

  • Cisco Systems
  • Missouri University of Science and Technology, Rolla

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Chingchi Chen

  • Ford Motor Company

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Matthew Drallmeier

  • ESDEMC Technology LLC

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Anfeng Huang

  • Missouri University of Science and Technology, Rolla

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Sergio Camerlo

  • Cisco Systems

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T. Jobava

  • EMCoS Ltd.

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Mojtaba Fallahpour

  • Missouri University of Science and Technology, Rolla

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Mehdi Kohani

  • University of Maryland
  • Missouri University of Science and Technology, Rolla

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Sameer Hemmady

  • TechFlow Scientific
  • University of New Mexico

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Joost Willemen

  • Infineon Technologies AG

Externe Person

Guang Xiao Luo

  • North China Electric Power University

Externe Person

Zhe Li

  • Missouri University of Science and Technology, Rolla

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Chen Wang

  • NVIDIA Research
  • Tohoku University

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Nicholas Erickson

  • Missouri University of Science and Technology, Rolla

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Michael Brower

  • Missouri University of Science and Technology, Rolla
  • Burns and McDonnell Engineering Company

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B. Archambeault

  • IBM System and Technology Group

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Michael G. Pecht

  • University of Maryland

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Paul Dixon

  • Laird Technologies

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Sameer Arun Walunj

  • Missouri University of Science and Technology, Rolla
  • Juniper Networks, Inc.

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Giulio Antonini

  • Università degli Studi dell'Aquila

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Morten Sorensen

  • Missouri University of Science and Technology, Rolla

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Peter Jalbert

  • United Technologies Aerospace Systems
  • Hamilton Sundstrand

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Lin Dai

  • Liaohe Petroleum Exploration Bureau

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Songping Wu

  • Missouri University of Science and Technology, Rolla

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I. Oganezova

  • EMCoS Ltd.
  • Ivane Javakhishvili Tbilisi State University

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G. Ghvedashvili

  • Ivane Javakhishvili Tbilisi State University

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Kohei Masuda

  • Panasonic Corporation

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Konstantin N. Rozanov

  • Russian Academy of Sciences, Moscow

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Ke Huang

  • Southwest Jiaotong University
  • Tongji University

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Michael Hillstrom

  • Missouri University of Science and Technology, Rolla
  • Apple Inc.

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Richard W. Kautz

  • Ford Motor Company

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Zongyi Chen

  • Technische Universität Dortmund

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Ponniah Ilavarasan

  • NVIDIA Research
  • Intel Corporation

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Joey Rivera

  • TechFlow Scientific

Externe Person

Ming Su

  • Guizhou Normal University

Externe Person

Darwin Zhang Li

  • Missouri University of Science and Technology, Rolla

Externe Person

Haixiao Weng

  • Texas Instruments
  • Missouri University of Science and Technology, Rolla

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Wang Kai

  • Intel Corporation
  • Missouri University of Science and Technology, Rolla

Externe Person

Yoshiki Kayano

  • Akita University

Externe Person

Jingook Kim

  • Ulsan National Institute of Science and Technology

Externe Person

Xiaoying Xu

  • Wuhan University of Technology

Externe Person

Chris Reade

  • NVIDIA Research

Externe Person

Shota Konno

  • Sony Global Manufacturing and Operations Corporation

Externe Person

Hemant Bishnoi

  • Missouri University of Science and Technology, Rolla

Externe Person

Xu Wang

  • Missouri University of Science and Technology, Rolla

Externe Person

Walter Hansch

  • Universität der Bundeswehr München

Externe Person

Mark A. Baumgartner

  • Missouri University of Science and Technology, Rolla

Externe Person

Ramu Seva

  • Monsanto Company
  • Missouri University of Science and Technology, Rolla

Externe Person

Sahra Sedigh

  • Missouri University of Science and Technology, Rolla

Externe Person

M. Cocchini

  • Missouri University of Science and Technology, Rolla

Externe Person

Michael Stockinger

  • NXP Semiconductors Austria GmbH

Externe Person

Wei Wu

  • Universität für Bodenkultur Wien
  • Huawei
  • Missouri University of Science and Technology, Rolla

Externe Person

Nam Hee Goo

  • Samsung Advanced Institute of Technology

Externe Person

Yuzo Takita

  • Sony Corporation

Externe Person

Ryan A. Pahl

  • Missouri University of Science and Technology, Rolla

Externe Person

A. Belarbi

  • Missouri University of Science and Technology, Rolla

Externe Person

Kevin P. Slattery

  • Intel Corporation
  • Tohoku University

Externe Person

Zhenwei Yu

  • Intel Corporation
  • Missouri University of Science and Technology, Rolla

Externe Person

Heng Wang

  • Guizhou Normal University

Externe Person

James Feddeler

  • NXP Semiconductors Austria GmbH

Externe Person

Greg Edgington

  • NXP Semiconductors Austria GmbH

Externe Person

Yiqiang Zhang

  • Nokia Corporation

Externe Person

Chao Zhang

  • Guizhou University

Externe Person

Andreas Klaedtke

  • Robert Bosch GmbH

Externe Person

Dong Hyun Kim

  • Missouri University of Science and Technology, Rolla

Externe Person

Soonjae Kwon

  • Samsung Group

Externe Person

Joshua L. Rovey

  • Missouri University of Science and Technology, Rolla

Externe Person

Philipp Hillenbrand

  • Robert Bosch GmbH

Externe Person

Jim Nadolny

  • Samtec Inc.

Externe Person

R. G. Djobava

  • Ivane Javakhishvili Tbilisi State University

Externe Person

Rui Mi

  • Missouri University of Science and Technology, Rolla

Externe Person

Taketoshi Sekine

  • Sony Corporation

Externe Person

Bin Chyi Tseng

  • ASUSTeK Computer Inc

Externe Person

Ruijie He

  • Missouri University of Science and Technology, Rolla

Externe Person

Wolfgang Stadler

  • Intel Mobile Communications

Externe Person

Dongshik Shin

  • LG Electronics

Externe Person

Lin Zhang

  • Lorentz Solution, Inc.
  • Intel Corporation

Externe Person

Matthew S. Halligan

  • Missouri University of Science and Technology, Rolla
  • Sandia National Laboratories, Albuquerque

Externe Person

James L. Drewniak

  • Missouri University of Science and Technology, Rolla

Externe Person

Martin Pommerenke

  • AVM Computersystem Vertriebs GmbH

Externe Person

Chunyu Wu

  • Missouri University of Science and Technology, Rolla

Externe Person

Joseph Bishop

  • Missouri University of Science and Technology, Rolla

Externe Person

Keyu Zhou

  • Missouri University of Science and Technology, Rolla

Externe Person

Jeffrey Dunnihoo

  • NXP Semiconductors

Externe Person

Mihir Suchak

  • Cisco Systems
  • Missouri University of Science and Technology, Rolla

Externe Person

Xiaorui Liu

  • Qingdao University
  • Missouri University of Science and Technology, Rolla
  • AVM Computersystem Vertriebs GmbH

Externe Person

Daniel Steven Stutts

  • Missouri University of Science and Technology, Rolla

Externe Person

Federico Pio Centola

  • Missouri University of Science and Technology, Rolla

Externe Person

Hongseok Kim

  • Missouri University of Science and Technology, Rolla

Externe Person

N. Adzinba

  • Ivane Javakhishvili Tbilisi State University

Externe Person

Ding Chong

  • Missouri University of Science and Technology, Rolla

Externe Person

Shaojie Xiang

  • Huazhong University of Science and Technology
  • Missouri University of Science and Technology, Rolla

Externe Person

Guangxiao Luo

  • Missouri University of Science and Technology, Rolla

Externe Person

Yin Sun

  • Missouri University of Science and Technology, Rolla

Externe Person

Hiroshi Inoue

  • Akita University

Externe Person

D. M. Hockanson

  • Sun Microsystems

Externe Person

Soumya De

  • Cisco Systems
  • Missouri University of Science and Technology, Rolla

Externe Person

Yilong Zhang

  • Missouri University of Science and Technology, Rolla

Externe Person

G. G. Greene

  • Missouri University of Science and Technology, Rolla

Externe Person

Cai Qing

  • Missouri University of Science and Technology, Rolla

Externe Person

Hark Byeong Park

  • Samsung Advanced Institute of Technology
  • Samsung Group

Externe Person

Weifeng Pan

  • Missouri University of Science and Technology, Rolla

Externe Person

T. Strehl

  • Technische Universität Berlin

Externe Person

Tzong Lin Wu

  • National Taiwan University

Externe Person

Ross Carlton

  • National Instruments
  • Freescale Semiconductor

Externe Person

Wanzhao Cui

  • Xi'an Jiaotong University
  • China Academy of Space Technology

Externe Person

Krzysztof Domanski

  • Intel Mobile Communications

Externe Person

Charles Jackson

  • NVIDIA Research

Externe Person

Frank Chang

  • NVIDIA Research

Externe Person

F. De Paulis

  • Università degli Studi dell'Aquila
  • Missouri University of Science and Technology, Rolla

Externe Person

S. Jagannathan

  • Missouri University of Science and Technology, Rolla

Externe Person

Qiaolei Huang

  • Missouri University of Science and Technology, Rolla

Externe Person

Jian Min Zhang

  • Missouri University of Science and Technology, Rolla

Externe Person

Shaowei Deng

  • Missouri University of Science and Technology, Rolla

Externe Person

Giuseppe Selli

  • Missouri University of Science and Technology, Rolla

Externe Person

Sunitha Chandra

  • Missouri University of Science and Technology, Rolla
  • NVIDIA Research

Externe Person

Markus Gonser

  • Robert Bosch GmbH

Externe Person

Zhaohai Jiang

  • Universität der Bundeswehr München

Externe Person

Lena Zeitlhoefler

  • Technische Universität München

Externe Person

Sunkyu Kong

  • Korea Advanced Institute of Science and Technology

Externe Person

Natalia Bondarenko

  • Cisco Systems
  • Missouri University of Science and Technology, Rolla

Externe Person

S. Connor

  • IBM System and Technology Group

Externe Person

Hanyu Zhang

  • Missouri University of Science and Technology, Rolla

Externe Person

David Johnsson

  • Intel Mobile Communications

Externe Person

R. Heinrich

  • Technische Universität Berlin

Externe Person

Hank Lin

  • ASUSTeK Computer Inc

Externe Person

Jason Whiles

  • Texas Instruments

Externe Person

R. Papazyan

  • KTH Royal Institute of Technology

Externe Person

Kainan Cha

  • Garmin International, Inc.
  • Missouri University of Science and Technology, Rolla

Externe Person

Victor Khikevich

  • Missouri University of Science and Technology, Rolla

Externe Person

Pranay Kumar Vuppunutala

  • Missouri University of Science and Technology, Rolla

Externe Person

Jun Chao She

  • Beijing University of Chemical Technology

Externe Person

Kenji Tan

  • Akita Research and Development Center

Externe Person

Ram Chundru

  • Apple Inc.

Externe Person

Keerthana Pamidimukkala

  • Missouri University of Science and Technology, Rolla

Externe Person

David Van Aken

  • Missouri University of Science and Technology, Rolla

Externe Person

Yong Cheh Ho

  • Missouri University of Science and Technology, Rolla

Externe Person

Bumhee Bae

  • Samsung Group

Externe Person

Gang Feng

  • Missouri University of Science and Technology, Rolla

Externe Person

Qijun Zhi

  • Guizhou Normal University

Externe Person

Tamar Makharashvilli

  • Missouri University of Science and Technology, Rolla

Externe Person

Manje Yea

  • Missouri University of Science and Technology, Rolla

Externe Person

Arpit Kothari

  • Missouri University of Science and Technology, Rolla

Externe Person

B. Xu

  • Chinese Academy of Science, Beijing National Laboratory for Condensed Matter Physics
  • Missouri University of Science and Technology, Rolla

Externe Person

F. Schmidt

  • Siemens AG

Externe Person

Parisa Faraji

  • Laird Technologies

Externe Person

Cheolgu Jo

  • Samsung Group

Externe Person

X. L. Shen

  • Missouri University of Science and Technology, Rolla

Externe Person

Wentao Li

  • Beijing University of Chemical Technology

Externe Person

Yoshifumi Shimoshio

  • National Institute of Technology (KOSEN), Kumamoto College

Externe Person

Masayuki Hirata

  • Osaka University, Endowed Research Department of Clinical Neuroengineering
  • Osaka University, Department of Neurosurgery
  • Fuji Xerox Co., Ltd.

Externe Person

R. Weigel

  • Friedrich-Alexander-Universität Erlangen-Nürnberg

Externe Person

Werner Simbürger

  • Infineon Technologies AG

Externe Person

L. G. Henry

  • Lucent Technologies

Externe Person

Zhiliang Gao

  • Beijing Oriental Institute of Metrology and Test

Externe Person

Qizheng Ji

  • Beijing Oriental Institute of Metrology and Test

Externe Person

R. Eriksson

  • KTH Royal Institute of Technology

Externe Person

Surbhi Mittal

  • Missouri University of Science and Technology, Rolla

Externe Person

Aman Aflaki-Beni

  • Missouri University of Science and Technology, Rolla

Externe Person

Reza Yazdani

  • Missouri University of Science and Technology, Rolla

Externe Person

Maochao Tian

  • Guizhou Normal University
  • Missouri University of Science and Technology, Rolla

Externe Person

Qinghua B. Chen

  • Cisco Systems

Externe Person

Jacob Hansen

  • Robert Bosch GmbH

Externe Person

Shao Peng

  • Missouri University of Science and Technology, Rolla

Externe Person

Theodore M. Zeeff

  • Hewlett-Packard Company

Externe Person

Zheng Lin Wen

  • Beijing University of Chemical Technology

Externe Person

Hüseyin Göksu

  • Missouri University of Science and Technology, Rolla

Externe Person

Paul Henny

  • Missouri University of Science and Technology, Rolla

Externe Person

Spartaco Caniggia

  • Settimo Milanese

Externe Person

Sachin Sharma

  • Missouri University of Science and Technology, Rolla

Externe Person

Michael Cracraft

  • IBM System and Technology Group

Externe Person

Gert Frølund Pedersen

  • Aalborg Universitet

Externe Person

Yong Chen Ho

  • Missouri University of Science and Technology, Rolla

Externe Person

Aleksandr Yakubovich Gafarov

  • Missouri University of Science and Technology, Rolla

Externe Person

Qiusen He

  • Missouri University of Science and Technology, Rolla

Externe Person

Robert Ashton

  • ON Semiconductor

Externe Person

Jian-Chi Zhou

  • Technische Universität Graz

Externe Person

John Maas

  • IBM System and Technology Group

Externe Person

Masamitsu Honda

  • Impulse Physics Laboratory, Inc.

Externe Person

Shiliang Xu

  • Beijing University of Chemical Technology

Externe Person

Abhinav Saxena

  • Missouri University of Science and Technology, Rolla

Externe Person

Sahra Sedighsarvestani

  • Missouri University of Science and Technology, Rolla

Externe Person

Pius Ng

  • Apache Design Solutions, Inc.

Externe Person

Wel Huang

  • Missouri University of Science and Technology, Rolla

Externe Person

Wolfgang Fimml

  • INNIO Jenbacher GmbH & Co OG

Externe Person

Jason A. Mix

  • Intel Corporation

Externe Person

Johannes V. Barth

  • Lucent Technologies
  • Technische Universität München

Externe Person

Ken Ichi Arai

  • Missouri University of Science and Technology, Rolla

Externe Person

Hyun Tae Jang

  • Samsung Advanced Institute of Technology

Externe Person

Jeffrey Birt

  • Missouri University of Science and Technology, Rolla

Externe Person

Huang Jun

  • Guizhou Normal University
  • Beijing Oriental Institute of Metrology and Test

Externe Person

Marcelo Perotoni

  • Federal University of ABC

Externe Person

Rajashree Ghorude

  • Missouri University of Science and Technology, Rolla

Externe Person

Dohyung Kim

  • LG Electronics

Externe Person

Sumiko Sakaguchi

  • Toshiba Corporation

Externe Person

Syed Huq

  • Missouri University of Science and Technology, Rolla

Externe Person

Feng Gang

  • Missouri University of Science and Technology, Rolla

Externe Person

Yang Xiangdong

  • Guizhou Normal University

Externe Person

Kiyeong Kim

  • Korea Advanced Institute of Science and Technology

Externe Person

Thomas Schwingshackl

  • Infineon Technologies AG
  • Technische Universität Graz

Externe Person

Yimin Ding

  • Motorola Austin

Externe Person

Jiayi He

  • Missouri University of Science and Technology, Rolla

Externe Person

Justin Hoyt

  • Missouri University of Science and Technology, Rolla

Externe Person

Kai Wang

  • Keck School of Medicine, Laboratory of FMRI Technology (LOFT)
  • Tsinghua University

Externe Person

Xiaolu Zhu

  • Missouri University of Science and Technology, Rolla

Externe Person

Julio Villafuerte

  • Defense Threat Reduction Agency

Externe Person

Qiupei Huang

  • University of Electronic Science and Technology of China

Externe Person

Mohd Zaid Abdullah

  • Universiti Sains Malaysia

Externe Person

Ralph Prestros

  • Silicon Austria Labs, GEMC

Externe Person

Su Ming

  • Guizhou Normal University

Externe Person

Donald C. Wunsch

  • Missouri University of Science and Technology, Rolla

Externe Person

Hao Shi

  • Apple Inc.

Externe Person

Maoxing Zhang

  • Tsinghua University

Externe Person

Hyungseok Lee

  • Samsung Group

Externe Person

Marty Johnson

  • Texas Instruments

Externe Person

Zachary Royer

  • Missouri University of Science and Technology, Rolla

Externe Person

Sheng Li

  • Zhenhua Electronic Co. Group of China

Externe Person

Simon Rauchel

  • Nexperia Germany GmbH

Externe Person

Yile Gu

  • Princeton University
  • Southeast University

Externe Person

Bao Cheng Huang

  • North China Electric Power University

Externe Person

Leo G. H Henry

  • ESD/TLP Consulting

Externe Person

Jingnan Pan

  • Missouri University of Science and Technology, Rolla

Externe Person

David Klein

  • Freescale Semiconductor

Externe Person

Xinxin Tian

  • Huazhong University of Science and Technology

Externe Person

Xin Chang

  • Missouri University of Science and Technology, Rolla

Externe Person

Nevin Altunyurt

  • Ford Motor Company

Externe Person

Yongjo Kim

  • Samsung Advanced Institute of Technology

Externe Person

Koichi Itou

  • Sony Corporation

Externe Person

Daniel Fischer

  • Missouri University of Science and Technology, Rolla

Externe Person

GY Shen

  • Missouri University of Science and Technology, Rolla

Externe Person

Yifeng Zeng

  • Washington University in St. Louis

Externe Person

Xiaohong Yang

  • Guizhou Aerospace Institute of Metrology and Test

Externe Person

Seuk Whan Lee

  • Samsung Advanced Institute of Technology

Externe Person

Jing Wu

  • University of Washington
  • Missouri University of Science and Technology, Rolla

Externe Person

Shuzhi Sam Ge

  • Missouri University of Science and Technology, Rolla

Externe Person

Masahiro Yamaguchi

  • Electromagnetic Compatibility Laboratory
  • Missouri University of Science and Technology, Rolla

Externe Person

Koo Jayong

  • Missouri University of Science and Technology, Rolla

Externe Person

Shichao Lou

  • Guizhou Normal University
  • Beijing Oriental Institute of Metrology and Test

Externe Person

Matthias Wintersteller

  • Technische Universität Graz

Externe Person

Steve Davidson

  • United Technologies Aerospace Systems

Externe Person

Tim Maloney

  • Intel Corporation

Externe Person

Jizhi Liu

  • University of Electronic Science and Technology of China

Externe Person

Alvaro Diez

  • INNIO Jenbacher GmbH & Co OG

Externe Person

Rosnah Antong

  • Universiti Sains Malaysia

Externe Person

Mingjie Sheng

  • Southeast University

Externe Person

Sin Ting Chen

  • National Taiwan University

Externe Person

G. Senko

  • Lucent Technologies

Externe Person

Ming Dou Ker

  • National Yang Ming Chiao Tung University

Externe Person

H. Hyatt

  • Lucent Technologies

Externe Person

P. L. Lewin

  • University of Southampton

Externe Person

Chen Zeng

  • Rice University

Externe Person

Mikheil Tsiklauri

  • Missouri University of Science and Technology, Rolla

Externe Person

Iana Muchaidze

  • Missouri University of Science and Technology, Rolla

Externe Person

Huiping Yang

  • South China Normal University

Externe Person

C. Richard Johnson

  • Laird Technologies

Externe Person

Jon Barth

  • Barth Electronics Inc.

Externe Person

Ghery Pettit

  • Intel Corporation

Externe Person

Keith Masterson

  • Hewlett-Packard Company

Externe Person

Zach Legenzoff

  • Missouri University of Science and Technology, Rolla

Externe Person

Kristen M. Donnell

  • Missouri University of Science and Technology, Rolla

Externe Person

Jingkun Mao

  • Amkor Technology

Externe Person

Benjamin Toby

  • Missouri University of Science and Technology, Rolla

Externe Person

Cheng Wang

  • NVIDIA Research
  • King Abdullah University of Science and Technology
  • University of Edinburgh

Externe Person

Sungnam Kim

  • LG Electronics

Externe Person

Tejasweeni D. Lingayat

  • Intel Technology India Pvt Ltd.

Externe Person

Sebastian Koch

  • Intel Deutschland GmbH
  • Infineon Technologies AG

Externe Person

Phil Berger

  • Missouri University of Science and Technology, Rolla

Externe Person

Y. Tian

  • University of Southampton

Externe Person

Yeong Hur

  • LG Electronics

Externe Person

John Mass

  • IBM Corporation

Externe Person

Nicholas Bennett Mentesana

  • Missouri University of Science and Technology, Rolla

Externe Person

J. S. Wilkinson

  • University of Southampton

Externe Person

Timothy A. D. Smith

  • Lucent Technologies

Externe Person

Xiaofei Ying

  • Missouri University of Science and Technology, Rolla

Externe Person

Huang Wei

  • Missouri University of Science and Technology, Rolla

Externe Person

Charvaka Duvvury

  • Texas Instruments

Externe Person

Mark Walker

  • Cobham Advanced Electronic Solutions

Externe Person

Tianxiong Ren

  • Tianjin University

Externe Person

G. Z. Chelidze

  • Ivane Javakhishvili Tbilisi State University

Externe Person

Yi Wang

  • Guizhou Normal University
  • DLR-Institut für Werkstoff-Forschung

Externe Person

Shaohua Li

  • Missouri University of Science and Technology, Rolla

Externe Person

Yuangdong Guo

  • Missouri University of Science and Technology, Rolla

Externe Person

Carlton Stayer

  • Missouri University of Science and Technology, Rolla

Externe Person

Takehiro Takahashi

  • Takushoku University

Externe Person

Wesley Hackenberger

  • Missouri University of Science and Technology, Rolla

Externe Person

A. S. Zaridze

  • Ivane Javakhishvili Tbilisi State University

Externe Person

Shun Liu

  • Huazhong University of Science and Technology

Externe Person

Shaofeng Luan

  • Sigrity Inc.

Externe Person

V. A.K. Prabhala

  • Missouri University of Science and Technology, Rolla

Externe Person

G. Bit-Babik

  • Ivane Javakhishvili Tbilisi State University

Externe Person

Wang Heng

  • Guizhou Normal University

Externe Person

Albert Ruehli

  • Missouri University of Science and Technology, Rolla

Externe Person

Bala P. Subramanya

  • Intel Technology India Pvt Ltd.

Externe Person

Jingdong Sun

  • Missouri University of Science and Technology, Rolla

Externe Person

Qingxia Li

  • Huazhong University of Science and Technology

Externe Person

Ling Wang

  • Tianjin University
  • Albany Medical College
  • Binghamton University-SUNY

Externe Person

Z. Zhou

  • Xi'an Jiaotong University
  • Southeast University

Externe Person

Mike Hopkins

  • Amber Precision Instruments

Externe Person

Kang Sung-Hee

  • LG Electronics

Externe Person

Yang Xiao

  • Southeast University

Externe Person

Yoeri Arien

  • Laird Technologies

Externe Person

Zhiwei Liu

  • University of Electronic Science and Technology of China

Externe Person

Chad Essary

  • Cobham Advanced Electronic Solutions

Externe Person

D. Lin

  • Lucent Technologies

Externe Person