Beschreibung
Tutorial Abstract – Technology scaling, which made electronics accessible andaffordable for everyone on the globe, has advanced IC and electronics since
the sixties. Nevertheless, it is well recognized that such scaling has introduced
new (and major) reliability challenges to the semiconductor industry. This
tutorial addresses the background mechanisms impacting the reliability of
very deep submicron (VDSM) integrated circuits (ICs). In more detail, topics
such as the basics about EMC and ionizing radiation, the mechanisms by which
they affect ICs, the current standards and laboratory test setup for
electromagnetic compatibility (EMC), total-ionizing dose (TID) and singleevent
effects (SEEs) on ICs are presented and their combined effects on the reliability of modern ICs are discussed. Moreover, reliability failure
mechanisms for (ionizing and non-ionizing) radiation, the way they are
modeled and how they are impacting IC lifetime will be covered. Laboratory
test setup and recent results from experimental measurements are
described. Classic design solutions to counteract with TID, SEEs and EMI in
VDSM ICs, as well as the recent achievements on the development of on-chip
sensors to monitor EM conducted noise on IC power supply lines of ICs, are
introduced. A YouTube video is presented to illustrate the effectiveness of
such on-chip sensors. Finally, Spice simulations are used to demonstrate the
combined effect of ionizing radiation with power supply noise on SRAM cells
followed by the presentation of some measures to counteract with it..
| Zeitraum | 6 Sept. 2019 |
|---|---|
| Ereignistitel | 2019 International Symposium on Electromagnetic Compatibility: EMC Europe 2019 |
| Veranstaltungstyp | Konferenz |
| Ort | Barcelona, SpanienAuf Karte anzeigen |
| Bekanntheitsgrad | International |