Adaptive Grinding Process (AGriPro) – Prevention of Thermal Damage using OPC UA Technique and in-Situ Metrology

Haas, F. (Redner/in), Matthias Steffan (Beitragende/r), Jens Gentzen (Beitragende/r), Alexander Pierer (Beitragende/r)

Aktivität: Vortrag oder PräsentationVortrag bei Konferenz oder FachtagungScience to public

Beschreibung

The authors introduce two approaches to minimize the safety margin thus optimize the process’ economic efficiency. Both control concepts use the feed rate override of the machining operation as regulating variable to eliminate thermal damage of the edge zone. The first control concept is developed to avoid thermal damage in cylindrical plunge grinding by controlling the cutting forces. Therefore, the industrial standard OPC Unified Architecture (OPC UA) is used for the communication between a PID-controller and the SINUMERIK grinding machine tool control system. For non-circular workpieces, grinding conditions change over the circumference. Therefore, thermal damage cannot be ruled out at any time during the grinding process. The authors introduces a second novel control approach which uses a micro-magnetic measure that correlates with thermal damage as the main control variable. Hence, the cutting ability of the grinding wheel and thermal damage to the workpiece edge zone is quantified in the process. The result is a control concept for grinding of non-circular workpieces, which opens up fields for major efficiency enhancement. With these two approaches, grinding processes are raised on higher economic level, independently of circular and non-circular workpiece geometries.
Zeitraum27 Okt 2017
Gehalten am2017 International Conference on Sustainable Manufacturing (ICSM)
VeranstaltungstypKonferenz
OrtShanghai, China
BekanntheitsgradInternational

Keywords

  • Schleifen
  • Adaptive Regelung
  • OPC UA
  • Barkhausen Rauschen
  • !!Mechanical Engineering
  • Mobility & Production
  • Experimental